AI/MLやセキュリティなどのソリューション、家電・自動車・セキュリティ・ヘルスケアなどの主要産業における重要なアプリケーションなどにおいて、超低消費電力・高性能・小型チップセットへの需要が高まってきております。これら困難なアプリケーションを駆動するカスタムチップには、数百万ゲートの設計と数百の特殊IPコア統合が必要とされますが、エンジニアには自動化ツールや専門知識をもってしても、厳しいスケジュールでタイムリーな市場投入への挑戦が求められています。
クエスト・グローバルの専門の経験を持つ半導体プラットフォームエンジニアは、エンドツーエンドの設計サービスを提供させていただき、お客様の開発部隊を増強し、製品設計のライフサイクルの複雑な課題をサポートして参ります。
The demand for ultra-low power, smaller form factor connectivity, AI and security chipsets is getting a significant boost with increased adoption of cutting-edge devices. Performance & reliability are the new success mantras.
The pervasive use of semiconductors is evident all around us - automotive, industrial, consumer electronics, with a total of 30 billion IoT connections expected by 2025. Connected devices & AI, the technology megatrend, is driving the development of custom chipsets.
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